Ottawa, Dec. 05, 2025 (GLOBE NEWSWIRE) -- According to a recent analysis by Towards Packaging, the global semiconductor assembly packaging equipment market is projected to expand from USD 5.35 billion ...

Lam Research (NasdaqGS:LRCX) has reportedly held takeover talks with BE Semiconductor Industries (BESI). The discussions ...

The role of packaging/assembly/test (P/A/T) in the overall successful commercialization of MEMS (microelectromechanical systems) has historically taken a backseat to device development. In the ...

Many packaging companies are turning to systems that combine the stretch blow molding (SBM) process with the bottling process in a single production flow. Pneumatic technologies can solve PET ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...